WebbBGA是英文Ball Grid Array Package的缩写,即球栅阵列封装。 采用BGA技术封装的内存,可以使内存在体积不变的情况下内存容量提高两到三倍,BGA与TSOP相比,具有更小的体积,更好的散热性能和电性能。 BGA封装技术使每平方英寸的存储量有了很大提升,采用BGA封装技术的内存产品在相同容量下,体积只有TSOP封装的三分之一;另外,与传 … WebbManufacturer. Hynix. Part Number. H5AN8G8NJJR-TFC. Package. Standard Monolithic 78-ball FBGA. Die Density / Count. 8 Gb J-die / 1 die. 是个J的,b的不是好么,是不是英文越 …
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Webb8 jan. 2024 · Standard Monolithic 78-ball FBGA: Serial Number: Die Density / Count: 00000000h: 8 Gb A-die (21 nm) / 1 die: JEDEC DIMM Label: Composition: 8GB 1Rx8 PC4 … Webb11 nov. 2024 · Standard Monolithic 78-ball FBGA Die Density / Count 8 Gb / 1 die Composition 1024Mb x8 (64Mb x8 x 16 banks) Input Clock Frequency 1067 MHz (0.938 ns) Minimum Timing Delays 15-15-15-36-50 Read Latencies Supported 24T, 23T, 22T, 21T, 20T, 19T, 18T... Supply Voltage 1.20 V front-loaded means
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Webb16 feb. 2024 · Feb 16, 2024. #1. Hello everyone, I'm a new user in this forum. I'm using Ryzen 5 1500x + MSI A320M Pro-E. When performing cpu stress test in CPUZ, HWinfo shows "Average effective clock speed" lower than core clock speeds. When I cpu stress test my 3 other computers, the "average effective clock speed" is the same as the core … WebbAs is the case with DDR4s, there is no chip in the middle of the PCB which is standard design layout. XPG D50 Compatibility: The dimension of a module is 40×133.35x8mm … Webb品 牌: micron (镁光) 厂家型号: MT40A2G8VA-062E:B TR. 商品编号: C2065320. 封装: FBGA-78 (10x11) 数据手册: 下载文件. 商品毛重: 0.366克 (g) 包装方式: 编带. 商品介 … ghost pre workout fat burner